To add a Cu Backing Plate with Indium Bonding for Sputtering Targets
Aluminum Nitride Sputtering Targets Specifications
|
Aluminum Nitride Substrate (AlN Ceramic)
|
Aluminum Nitride Nanometer Powder
|
Typical Analysis: 99.9% AlN
Chemical Analysis via ICP-AES |
|
Element |
Value (ppm) |
Ni |
112 |
Fe |
265 |
Si |
80 |
Ca |
44 |
Mg |
20 |
Cu |
60 |
N |
33.7% |